Product Name :

KAL Series

Product Description

2019欧美girls另类 www.vid28.cn QFN Tape/Polyimide PI Tape/PCB Masking/QFN Back Tape/Kapton Tape/High Temperature
Application/Heat Press Tape/FPC Tape

Product Introduction

Excellent Heat Resistance。No adhesive residue。Excellent property with wires。
For QFN molding process。

Product CodeProduct DescriptionPhysical PropertyApplications
KAL278 PI Film Total Thickness 33 um QFN molding process
Adhesive Strength   50-150  g/in.
Release force 3↓  g/in.
KAL279 PI Film Total Thickness 35 um QFN molding process
Adhesive Strength   100-250  g/in.
Release force 3↓  g/in.